Die Pick up Tools are commonly used to move semiconductor wafers from one position to another in the semiconductor manufacturing process. During this process, wafers need to be transferred between various tools, such as chemical vapor deposition equipment, physical vapor deposition equipment, photolithography machines, etching machines, and cleaning machines. In order to reduce contamination and damage to the surface of the wafers, nozzles are often used to handle them
Advantages of Electric Vehicle Parts
- Hard and durable material
- High heat resistance
- Customizable
