Wire Bonding Tool
Wire bonding tool is a high-precision semiconductor tool, and the quality of its materials and manufacturing processes directly affect its bonding effectiveness and working life.
Therefore, strict control of the quality of materials and processing technology is necessary during the design and manufacture of wire bonding tools to ensure the stability of their performance and service life.
It is mainly used in semiconductor packaging and manufacturing, and is used to bond metal wires to semiconductor chips or packaging substrates.
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- Product Features
To ensure long-term durability and corrosion resistance, Vimic uses high-quality hard alloys or stainless steel materials to manufacture wire bonding tools. In addition to enhance the tool's wear resistance and hardness, some components of the wire bonding tool may also be made of special materials such as ceramics and hard alloys.
These materials have excellent physical properties and can effectively improve the tool's lifespan and efficiency.
